Why do Research International ovens stay flux-free while others need cleaning maintenance?

Research International's patented gas circulation pattern keeps flux particles above their condensation temperature within the heater cavity, then purges the contaminated gas away from internal structures. In this way, flux never solidifies within the heater cavities and the oven stays clean continuously. Eliminating flux cleaning maintenance is crucial to achieve 24-hour constant production rates for SMT assembly.

How many Effective Zones do I need in my Reflow Oven?

Properly designed zones eliminate thermal interaction between individual heating elements. Many ovens treat zones as simply 12-inch heater panels, with the corresponding profile looking like it came from an oven with fewer zones. Research International designs zones of varying length which eliminate thermal interaction between zones. These "Effective" zones provide temperature separation for preheat, dryout, reflow and cooling stages of the reflow process.

What is the difference between IR and Convection in SMT?

There are several differences between IR and convection in SMT. The key to success is knowing how each heating technology works.

In SMT reflow applications, there is no such thing as a pure convection or pure IR. Convection, conduction and IR all play a role in the heating process. A system, however, may be dominated by convection or IR, but the other heat transfer is always present.

A convection dominant system is useful when heating a product that has a large different in the mass and distribution of the components. The larger components will continue to heat while the smaller components will not overheat. This is because, in convection, the product temperature will never exceed the gas flow temperature.

An IR dominant system is helpful when reflowing very dense SMT assemblies or very heavy boards. This is because IR systems have the ability to transfer high quantities of heat as needed. IR is also ideal for curing applications. IR systems have the distinct advantage of high heating efficiencies and low process gas flows required to reflow solder.