BGA Solder Ball Attachment Convection Ovens

ChipFlo attaches more solder balls in less floor space than any other oven. Period.

ChipFlo ovens are designed for high-volume Chip Scale Packaging (CSP) and Ball Grid Array (BGA) chip production. Wafer solder bumping (flip chips) and package lead attachment (BGAs) are typical applications. ChipFlo provides the smallest footprint for high throughput clean room assembly. Our design offers the unique combination of minimal floor space, a variety of chip transport production methods, low velocity nitrogen convection heat transfer. ChipFlo ovens can interface with any ball placement system or cleaner, including the next generation ACC-4000 cleaner from GPD.

Features

• 4 or 5 vertical heat zones
• Space saving 72-inch (183 cm) linear footprint
• Narrow 36-inch (91 cm) machine width
• Exclusive Low Velocity Nitrogen Convection (LVNC) heat transfer method
• Conveyor transport options ranging from Tape Drives (high volume, small chip package) to traditional belt conveyors (high volume, large chip package)
• Easy to use StarWin™ Operating Software
• Exhaust drawn above and below chips during production (maintain clean room purity)
• ConstantClean™ Self Cleaning Oven Technology eliminating heater cavity flux build-up
• StarComm™ Remote Communication Service for on-line process consultation via modem
• Closed Loop Liquid Cooling
• SPC Logging Capability for logging oven operation
• Common European (CE) Product Safety Certification
• Research, Inc. built industrial grade controller used to control oven operation (Complete UPS Capability)

Benefits

• Maximum up time since cleaning maintenance eliminated
• Minimal floor space for clean room production
• High throughput convection heat transfer without fans which "blow" solder balls off the substrate
• Simple oven operating software makes set up easy
• Production transport options (Wire Belt and Tape Drives)
• Clean room atmospheric purity maintained
• International production flexibility (multi-language operating software)